Dr Yunsong Pang is an Assistant Research Fellow at the Shenzhen Institute of Advanced Electronic Materials, affiliated with the Chinese Academy of Sciences. He holds a PhD in Aerospace and Mechanical Engineering, along with MS degrees in Mechanical Engineering and Applied Mathematics and Statistics from the University of Notre Dame, USA. His expertise lies in developing chip-scale thermal interface materials, crucial for enhancing electronic component efficiency and reliability. As a recognized talent under Shenzhen’s high-level talent programs, Yunsong Pang continues to pioneer advancements in thermal management technologies.
Publication Profile
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Education
Yunsong Pang earned his bachelor’s degree in Thermal and Power Engineering from the University of Science and Technology of Liaoning. He pursued further education in the United States, completing a PhD in Aerospace and Mechanical Engineering, as well as master’s degrees in Mechanical Engineering and Applied Mathematics and Statistics at the University of Notre Dame. His academic journey has equipped him with a robust interdisciplinary background essential for his research in thermal interface materials and their applications in electronic systems.
Experience
Currently serving as an Assistant Research Fellow at the Shenzhen Institute of Advanced Electronic Materials, Yunsong Pang is deeply engaged in research focused on developing innovative thermal interface materials. He has been recognized as a Shenzhen Overseas High-Level C Talent and a Shenzhen Bao’an District High-Level Comprehensive Talent. His career path underscores a commitment to advancing technologies that optimize heat dissipation in electronic devices, thereby improving their performance and longevity through effective thermal management solutions.
Research Focus
Yunsong Pang’s research centers on designing and manufacturing thermal interface materials tailored for efficient heat dissipation in electronic components. His work addresses critical challenges in managing the thermal interface between chips and their surroundings, crucial for maintaining optimal operating temperatures and preventing overheating-induced malfunctions. By advancing these materials, he contributes to the development of more compact and powerful electronic systems capable of sustaining high performance under diverse operational conditions.
Publication Top Notes
“An Ultra-soft Thermal Diode”
“Grafted Alkene Chains: Triggers for Defeating Contact Thermal Resistance in Composite Elastomers”
“Compliant composite elastomers via grafting short dangling chains for promoting thermal transport performance”
“Soft, Tough, and Thermally Conductive Elastomer Composites by Constructing a Curled Conformation”